Added Value Technology is your quick-turn source for the MacStan^® HSR™ Immersion Tin process. A lead-free alternative to hot air leveling (HAL), the process deposits an organo-metallic tin with a fine-grained structure that eliminates whisker growth. The tin deposit demonstrates excellent solderability characteristics even after multiple heat excursions, harsh environmental and storage conditions.

Benefits

• Replacement for HAL
• Extremely flat finish
• Compatible with soldermasks, flux and pastes
• Improved PWB structural integrity

Capabilities

• Thickness: 20-50 microinches
• Standard Panel Size: 9 x 12 - 22 x 27. Routed parts and other panel sizes may be processed, call for details
• Flex and Rigid Capabilities

MacDermid