Added Value Technology is your quick-turn source for the MacStan® HSR
Immersion Tin process. A lead-free alternative to hot air leveling (HAL), the process deposits
an organo-metallic tin with a fine-grained structure that eliminates whisker growth. The tin
deposit demonstrates excellent solderability characteristics even after multiple heat
excursions, harsh environmental and storage conditions.
Benefits
- Replacement for HAL
- Extremely flat finish
- Compatible with soldermasks, flux and pastes
- Improved PWB structural integrity
Capabilities
- Thickness: 20-50 microinches
- Standard Panel Size: 9 x 12 - 22 x 27. Routed parts and other panel sizes may be processed, call for details
- Flex and Rigid Capabilities
MacDermid |