Added Value Technology
Entek® Plus HT

Added Value Technology is your quick-turn source for Enthone's Entek® Plus HT process. This process will selectively coat copper pads and through-holes with a durable film that maintains surface planarity and solderability even when subjected to multiple eutechtic or lead-free SMT thermal reflow cycles. ENTEK® PLUS HT OSP enables high reliability and consistently high solderjoint strength during electronic assembly.

    Benefits:
  • Fast processing time
  • Re-workable
  • Superior Solderability
  • More reflow cycles than most other OSP processes (up to 9 reflows)
  • RoHS compliant
    Capabilities:
  • Standard Thickness: 0.2 to 0.6 microns (8 to 24 microinches)
  • Standard Panel Size: Maximum panel size is 18" x 24". Routed parts and other panel sizes smaller may be processed. Please call for details.
  • Flex and Rigid Capabilities
  • Same day processing


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