Added Value Technology is your quick-turn source for Enthone's Entek® Plus HT process. This process will selectively coat copper pads and through-holes with a durable film that maintains surface planarity and solderability even when subjected to multiple eutechtic or lead-free SMT thermal reflow cycles. ENTEK® PLUS HT OSP enables high reliability and consistently high solderjoint strength during electronic assembly.

Benefits:
• Fast processing time
• Re-workable
• Superior Solderability
• More reflow cycles than most other OSP processes (up to 9 reflows)
• RoHS compliant

Capabilities:
• Standard Thickness: 0.2 to 0.6 microns (8 to 24 microinches)
• Standard Panel Size: Maximum panel size is 18" x 24". Routed parts and other panel sizes smaller may be processed. Please call for details.
• Flex and Rigid Capabilities
• Same day processing

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