Added Value Technology
Hot Air Solder Leveling

Added Value Technology is pleased to offer Hot Air Leveling (HAL). This horizontal leveling system allows an extremely flat finish. Although other, newer, technologies offer advancements over HAL, the process still offers a cost-effective and high-quality option when the application demands it.

Lead Free
RoHS Compliant Finish
AVT utilizing Florida Cirtech's Tin, Nickel, Copper Alloy

Capabilities

  • Standard Thickness: 100-500 microinches
  • Standard Panel Size: 9 x 12 - 24 x 36
    Routed parts and other panel sizes may be processed, call for details
  • Flex and Rigid Capabilities

Florida Cirtech, Inc