GENERAL INFORMATION

Rigid Flex Routed Parts

Panel Size  Quantity Thickness



PROCESS

HAL

Soldermask  

Letterscreen   

Immersion Silver (Self limiting process, thickness will be 2-20 microinches)

Immersion Tin (Self limiting process, thickness will be 20-50 microinches)

Electroless Nickel/Immersion Gold

Nickel only
Nickel and Gold

Nickel Tickness
(Typical range of 50-300 microinches)
Gold thickness is self limiting 3-8"


(Bare copper area including holes)


(If soldermask will be applied prior to plating)